Vol. 7, Issue 1, 2010January 01, 2010 EDT
Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications
Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications
Ramesham, Rajeshuni. 2010. “Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications.” Journal of Microelectronics and Electronic Packaging 7 (1): 16–24. https://doi.org/10.4071/1551-4897-7.1.16.