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Vol. 7, Issue 1, 2010
January 01, 2010 EDT
Design and Process of 3D MEMS System-in-Package (SiP)
John H. Lau
,
MEMS
TSV
SiP
3D IC integration
low-temperature bonding
wafer-level packaging
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https://doi.org/10.4071/1551-4897-7.1.10
Journal of Microelectronics & Elect Pkg
Lau, John H. 2010. “Design and Process of 3D MEMS System-in-Package (SiP).”
Journal of Microelectronics and Electronic Packaging
7 (1): 10–15.
https://doi.org/10.4071/1551-4897-7.1.10
.
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