ISSN 1551-4897
Vol. 6, Issue 3, 2009July 01, 2009 EDT
Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization
Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization
Marques, V., C. Johnston, and P.S. Grant. 2009. “Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization.” Journal of Microelectronics and Electronic Packaging 6 (3): 182–85. https://doi.org/10.4071/1551-4897-6.3.182.