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Vol. 6, Issue 3, 2009July 01, 2009 EDT

Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization

V. Marques, C. Johnston, P.S. Grant,
Aerospace applicationslead free soldersnano-indentationreliability
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-6.3.182
Journal of Microelectronics & Elect Pkg
Marques, V., C. Johnston, and P.S. Grant. 2009. “Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization.” Journal of Microelectronics and Electronic Packaging 6 (3): 182–85. https:/​/​doi.org/​10.4071/​1551-4897-6.3.182.
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