Vol. 6, Issue 3, 2009July 01, 2009 EDT
Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device
Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device
O’Neal, Chad B., Ajay P. Malshe, William F. Schmidt, Matthew H. Gordon, and William D. Brown. 2009. “Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device.” Journal of Microelectronics and Electronic Packaging 6 (3): 164–71. https://doi.org/10.4071/1551-4897-6.3.164.