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Vol. 6, Issue 3, 2009July 01, 2009 EDT

Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages

Radosvet G. Arnaudov,
Cavity-resonance modes electromagnetic interference (EMI)electronic band-gap structures (EBG)full-wave analysisLTCCmicrowave packagesMCMradiated emissionspropagation constantwavenumber
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-6.3.172
Journal of Microelectronics & Elect Pkg
Arnaudov, Radosvet G. 2009. “Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages.” Journal of Microelectronics and Electronic Packaging 6 (3): 172–81. https:/​/​doi.org/​10.4071/​1551-4897-6.3.172.
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