Vol. 6, Issue 3, 2009July 01, 2009 EDT
Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages
Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages
Arnaudov, Radosvet G. 2009. “Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages.” Journal of Microelectronics and Electronic Packaging 6 (3): 172–81. https://doi.org/10.4071/1551-4897-6.3.172.