Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems

Stanislav Slosarčík; Igor Vehec; Alexander Gmiterko; Pavol Cabúk; Michal Jurčišin

doi:10.4071/1551-4897-6.3.158

Loading [Contrib]/a11y/accessibility-menu.js

Slosarčík, Stanislav, Igor Vehec, Alexander Gmiterko, Pavol Cabúk, and Michal Jurčišin. 2009. “Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems.” Journal of Microelectronics and Electronic Packaging 6 (3): 158–63. https://doi.org/10.4071/1551-4897-6.3.158.

View more stats