Vol. 6, Issue 3, 2009July 01, 2009 EDT
Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems
Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems
Slosarčík, Stanislav, Igor Vehec, Alexander Gmiterko, Pavol Cabúk, and Michal Jurčišin. 2009. “Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems.” Journal of Microelectronics and Electronic Packaging 6 (3): 158–63. https://doi.org/10.4071/1551-4897-6.3.158.