Vol. 6, Issue 3, 2009July 01, 2009 EDT
Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications
Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications
Chinen, Sean M., and Matthew T. Siniawski. 2009. “Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications.” Journal of Microelectronics and Electronic Packaging 6 (3): 149–53. https://doi.org/10.4071/1551-4897-6.3.149.