ISSN 1551-4897
Vol. 6, Issue 3, 2009July 01, 2009 EDT
Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC Packaging Applications
Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC Packaging Applications
Choi, Daniel, Viola Fucsko, E. H. Yang, Jung-Rae Park, Fahad Khalid, and Young-Kun Kim. 2009. “Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC Packaging Applications.” Journal of Microelectronics and Electronic Packaging 6 (3): 154–57. https://doi.org/10.4071/1551-4897-6.3.154.