Vol. 6, Issue 2, 2009April 01, 2009 EDT
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages
Kim, Sang Ha, Hiroshi Tabuchi, Chika Kakegawa, and Han Park. 2009. “IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages.” Journal of Microelectronics and Electronic Packaging 6 (2): 119–24. https://doi.org/10.4071/1551-4897-6.2.119.