Vol. 6, Issue 2, 2009April 01, 2009 EDT
Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LED
Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LED
Liu, Jay G., Daxi Xiong, and Paul Panaccione. 2009. “Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LED.” Journal of Microelectronics and Electronic Packaging 6 (2): 143–48. https://doi.org/10.4071/1551-4897-6.2.143.