Solder Joint Reliability on 3-D MID LCP Substrates

Minna Arra; Esko J Pääkkönen; Ilkka Härkönen

doi:10.4071/1551-4897-6.2.135

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Arra, Minna, Esko J Pääkkönen, and Ilkka Härkönen. 2009. “Solder Joint Reliability on 3-D MID LCP Substrates.” Journal of Microelectronics and Electronic Packaging 6 (2): 135–42. https://doi.org/10.4071/1551-4897-6.2.135.

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