Vol. 6, Issue 1, 2009January 01, 2009 EDT
LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering
LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering
Glitzky, Carsten, Torsten Rabe, Markus Eberstein, Wolfgang A. Schiller, Jörg Töpfer, Stefan Barth, and Annette Kipka. 2009. “LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering.” Journal of Microelectronics and Electronic Packaging 6 (1): 49–53. https://doi.org/10.4071/1551-4897-6.1.49.