LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering

Carsten Glitzky; Torsten Rabe; Markus Eberstein; Wolfgang A. Schiller; Jörg Töpfer; Stefan Barth; Annette Kipka

doi:10.4071/1551-4897-6.1.49

Loading [Contrib]/a11y/accessibility-menu.js

Glitzky, Carsten, Torsten Rabe, Markus Eberstein, Wolfgang A. Schiller, Jörg Töpfer, Stefan Barth, and Annette Kipka. 2009. “LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering.” Journal of Microelectronics and Electronic Packaging 6 (1): 49–53. https://doi.org/10.4071/1551-4897-6.1.49.

View more stats