Vol. 6, Issue 1, 2009January 01, 2009 EDT
Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect
Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect
Kacker, Karan, and Suresh K. Sitaraman. 2009. “Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect.” Journal of Microelectronics and Electronic Packaging 6 (1): 59–65. https://doi.org/10.4071/1551-4897-6.1.59.