A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

Vivek Chidambaram; John Hald; Jesper Hattel

doi:10.4071/1551-4897-6.1.75

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Chidambaram, Vivek, John Hald, and Jesper Hattel. 2009. “A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications.” Journal of Microelectronics and Electronic Packaging 6 (1): 75–82. https://doi.org/10.4071/1551-4897-6.1.75.

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