ISSN 1551-4897
Vol. 6, Issue 1, 2009January 01, 2009 EDT
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
Articles in Vol. 6, Issue 1, 2009
Vol. 6, Issue 1, 2009
- Enhancement of Fine Line Print Resolution due to Coating of Screen FabricsDieter SchwankeJürgen PohlnerAndreas WonischTorsten KraftJürgen Geng
- Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 SystemBernhard MusslerDieter Schwanke
- Hermetic Package for Optical MEMSF. SeigneurY. FournierT. MaederP. RyserJ. Jacot
- Ceramic Microwave Circuits for Satellite CommunicationR. KulkeG. MöllenbeckC. GünnerP. UhligK.H. DrüeS. HumblaJ. MüllerR. StephanD. StöpelJ.F. TrabertG. VogtM.A. HeinA. MolkeT. BarasA.F. JacobD. SchwankeJ. PohlnerA. SchwarzG. Reppe
- Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICSLewis Dove
- Miniaturized Embossed Low Resistance Fine Line Coils in LTCCR. PerroneH. Bartsch de TorresM. HoffmannM. MachJ. Müller
- Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired CeramicsDouglas L. KellisAmy J. MollDonald G. Plumlee
- Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine ViasArne AlbertsenKoji KoiwaiKyoji KobayashiTomonori OguchiKatsumi Aruga
- Silver-Indium Transient Liquid Phase Sintering for High Temperature Die AttachmentPedro O. QuinteroF. Patrick McCluskey
- A Feasibility Study of Lead Free Solders for Level 1 Packaging ApplicationsVivek ChidambaramJohn HaldJesper Hattel
- The Effect of Ultrasonic Frequency on Gold Wire Bondability and ReliabilityJianbiao PanMinh-Nhat LeCuong Van Pham
- The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature LaminateJoe KuczynskiSilvio Bertling
- Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip InterconnectKaran KackerSuresh K. Sitaraman
- Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCCM. FischerH. Bartsch de TorresB. PawlowskiR. GadeS. BarthM. MachM. StubenrauchM. HoffmannJ. Müler
- LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-SinteringCarsten GlitzkyTorsten RabeMarkus EbersteinWolfgang A. SchillerJörg TöpferStefan BarthAnnette Kipka
Chidambaram, Vivek, John Hald, and Jesper Hattel. 2009. “A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications.” Journal of Microelectronics and Electronic Packaging 6 (1): 75–82. https://doi.org/10.4071/1551-4897-6.1.75.