Vol. 6, Issue 1, 2009January 01, 2009 EDT
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
Chidambaram, Vivek, John Hald, and Jesper Hattel. 2009. “A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications.” Journal of Microelectronics and Electronic Packaging 6 (1): 75–82. https://doi.org/10.4071/1551-4897-6.1.75.