The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability

Jianbiao Pan; Minh-Nhat Le; Cuong Van Pham

doi:10.4071/1551-4897-6.1.89

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Pan, Jianbiao, Minh-Nhat Le, and Cuong Van Pham. 2009. “The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability.” Journal of Microelectronics and Electronic Packaging 6 (1): 89–95. https://doi.org/10.4071/1551-4897-6.1.89.

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