Vol. 6, Issue 1, 2009January 01, 2009 EDT
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability
Pan, Jianbiao, Minh-Nhat Le, and Cuong Van Pham. 2009. “The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability.” Journal of Microelectronics and Electronic Packaging 6 (1): 89–95. https://doi.org/10.4071/1551-4897-6.1.89.