Vol. 6, Issue 1, 2009January 01, 2009 EDT
Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias
Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias
Albertsen, Arne, Koji Koiwai, Kyoji Kobayashi, Tomonori Oguchi, and Katsumi Aruga. 2009. “Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias.” Journal of Microelectronics and Electronic Packaging 6 (1): 6–12. https://doi.org/10.4071/1551-4897-6.1.6.