Vol. 6, Issue 1, 2009January 01, 2009 EDT
Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS
Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS
Dove, Lewis. 2009. “Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS.” Journal of Microelectronics and Electronic Packaging 6 (1): 38–41. https://doi.org/10.4071/1551-4897-6.1.38.