Vol. 5, Issue 4, 2008October 01, 2008 EDT
Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
Kim, Sang Ha, Chika Kakegawa, Hiroshi Tabuchi, and Han Park. 2008. “Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP).” Journal of Microelectronics and Electronic Packaging 5 (4): 180–87. https://doi.org/10.4071/1551-4897-5.4.180.