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Vol. 6, Issue 1, 2009
January 01, 2009 EDT
Hermetic Package for Optical MEMS
F. Seigneur
,
Y. Fournier
,
T. Maeder
,
P. Ryser
,
J. Jacot
,
Hermetic packaging
interconnections
LTCC
MOEMS
solder sealing
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/1551-4897-6.1.32
Journal of Microelectronics & Elect Pkg
Seigneur, F., Y. Fournier, T. Maeder, P. Ryser, and J. Jacot. 2009. “Hermetic Package for Optical MEMS.”
Journal of Microelectronics and Electronic Packaging
6 (1): 32–37.
https://doi.org/10.4071/1551-4897-6.1.32
.
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