Vol. 5, Issue 4, 2008October 01, 2008 EDT
Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
Vincent, T.S. 2008. “Predicting the Thermal Conductivity of Low Temperature Co-Fired Ceramic with Embedded Thermal via Arrays Using the Rule-of-Mixtures and Interface Area Analytical Methods.” Journal of Microelectronics and Electronic Packaging 5 (4): 174–79. https://doi.org/10.4071/1551-4897-5.4.174.