Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates

A. Bittner; T. Bohnenberger; R. Engel; H. Seidel; U. Schmid

doi:10.4071/1551-4897-5.4.169

Bittner, A., T. Bohnenberger, R. Engel, H. Seidel, and U. Schmid. 2008. “Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates.” Journal of Microelectronics and Electronic Packaging 5 (4): 169–73. https://doi.org/10.4071/1551-4897-5.4.169.

View more stats

Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates

This website uses cookies