Vol. 5, Issue 4, 2008October 01, 2008 EDT
Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates
Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates
Bittner, A., T. Bohnenberger, R. Engel, H. Seidel, and U. Schmid. 2008. “Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates.” Journal of Microelectronics and Electronic Packaging 5 (4): 169–73. https://doi.org/10.4071/1551-4897-5.4.169.