Vol. 5, Issue 3, 2008July 01, 2008 EDT
Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems
Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems
Zhang, Lizheng, and I. Charles Ume. 2008. “Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems.” Journal of Microelectronics and Electronic Packaging 5 (3): 97–103. https://doi.org/10.4071/1551-4897-5.3.97.