ISSN 1551-4897
Vol. 5, Issue 3, 2008July 01, 2008 EDT
Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems
Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems
Articles in Vol. 5, Issue 3, 2008
Vol. 5, Issue 3, 2008
- Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric SubstratesDennis LeungGuna Selvaduray
- Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic MaterialsAaron D. HalvorsenPooja VaidyaMatthew RobinsonDouglas L. Schulz
- Packaging MEMS Die on E-Glass SubstratesM. BlackH. BoyettN. SandersJ. WellerR. DeanR.W. JohnsonM. Kranz
- Reflection by Embedded Copper Plane and Volumetric Heating in Laser Microvia DrillingChong ZhangIslam A. SalamaYonggang LiNathaniel R. QuickAravinda Kar
- Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection SystemsLizheng ZhangI. Charles Ume
- Interconnect Analysis for 80-Gbps Serial Link DesignJonathan FasigGregory RashBarbara RandallKarl FritzSteven CurrieBart McCoyPaul RiemerWendy WilkinsBarry GilbertErik Daniel
Zhang, Lizheng, and I. Charles Ume. 2008. “Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems.” Journal of Microelectronics and Electronic Packaging 5 (3): 97–103. https://doi.org/10.4071/1551-4897-5.3.97.