An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic Packaging

Sujan, D., M.V.V. Murthy, A.Y. Hassan, and K.N. Seetharamu. 2008. “An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 5 (1): 36–42. https://doi.org/10.4071/1551-4897-5.1.36.