ISSN 1551-4897
Black, M., H. Boyett, N. Sanders, J. Weller, R. Dean, R.W. Johnson, and M. Kranz. 2008. “Packaging MEMS Die on E-Glass Substrates.” Journal of Microelectronics and Electronic Packaging 5 (3): 122–25. https://doi.org/10.4071/1551-4897-5.3.122.