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Vol. 5, Issue 3, 2008
July 01, 2008 EDT
Packaging MEMS Die on E-Glass Substrates
M. Black
,
H. Boyett
,
N. Sanders
,
J. Weller
,
R. Dean
,
R.W. Johnson
,
M. Kranz
,
COTS
laminate
MEMS
packaging
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/1551-4897-5.3.122
Journal of Microelectronics & Elect Pkg
Black, M., H. Boyett, N. Sanders, J. Weller, R. Dean, R.W. Johnson, and M. Kranz. 2008. “Packaging MEMS Die on E-Glass Substrates.”
Journal of Microelectronics and Electronic Packaging
5 (3): 122–25.
https://doi.org/10.4071/1551-4897-5.3.122
.
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