Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates

Dennis Leung; Guna Selvaduray

doi:10.4071/1551-4897-5.3.104

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Leung, Dennis, and Guna Selvaduray. 2008. “Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates.” Journal of Microelectronics and Electronic Packaging 5 (3): 104–15. https://doi.org/10.4071/1551-4897-5.3.104.

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