Vol. 5, Issue 3, 2008July 01, 2008 EDT
Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates
Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates
Leung, Dennis, and Guna Selvaduray. 2008. “Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates.” Journal of Microelectronics and Electronic Packaging 5 (3): 104–15. https://doi.org/10.4071/1551-4897-5.3.104.