Vol. 5, Issue 2, 2008April 01, 2008 EDT
Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)
Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)
Abdullah, M. Khalil, M.Z. Abdullah, M.A. Mujeebu, S. Kamaruddin, and Z.M. Ariff. 2008. “Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP).” Journal of Microelectronics and Electronic Packaging 5 (2): 62–67. https://doi.org/10.4071/1551-4897-5.2.62.