Numerical Optimization of Silicon Stacked Module for 3-D Packaging Applications

Viswanath, Akella G.K., Xiaowu Zhang, Y.Y. Wang, S.W. Yoon, Navas Khan, and Vaidyanathan Kripesh. 2008. “Numerical Optimization of Silicon Stacked Module for 3-D Packaging Applications.” Journal of Microelectronics and Electronic Packaging 5 (2): 68–76. https://doi.org/10.4071/1551-4897-5.2.68.