Vol. 15, Issue 3, 2018July 01, 2018 EDT
A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement
A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement
Bharath R. Bharadwaj, SriNithish Kandagadla, Praveen J. Nadkarni, V. Krishna, T. R. Seetharam, K. N. Seetharamu,
Bharadwaj, Bharath R., SriNithish Kandagadla, Praveen J. Nadkarni, V. Krishna, T. R. Seetharam, and K. N. Seetharamu. 2018. “A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement.” Journal of Microelectronics and Electronic Packaging 15 (3): 117–25. https://doi.org/10.4071/imaps.658722.