Reliability Assessment: New Tools for the Next Generation of Packages

Isabelle Bord; Bruno Levrier; Yannick Deshayes; Laurent Béchou; Yves Ousten

doi:10.4071/1551-4897-5.2.44

Bord, Isabelle, Bruno Levrier, Yannick Deshayes, Laurent Béchou, and Yves Ousten. 2008. “Reliability Assessment: New Tools for the Next Generation of Packages.” Journal of Microelectronics and Electronic Packaging 5 (2): 44–51. https://doi.org/10.4071/1551-4897-5.2.44.

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