Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability

C.I. Chen; S.C. Wu; D.S. Liu; C.Y. Ni; T. D. Yuan

doi:10.4071/1551-4897-4.4.186

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Chen, C.I., S.C. Wu, D.S. Liu, C.Y. Ni, and T. D. Yuan. 2007. “Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability.” Journal of Microelectronics and Electronic Packaging 4 (4): 186–94. https://doi.org/10.4071/1551-4897-4.4.186.

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