Comparison of High-Resolution Patterning Technologies for LTCC Microwave Circuits

J. Müller; R. Perrone; K.-H. Drüe; R. Stephan; J. Trabert; M. Hein; D. Schwanke; J. Pohlner; G. Reppe; R. Kulke; P. Uhlig; A.F. Jacob; T. Baras; A. Molke

doi:10.4071/1551-4897-4.3.99

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Müller, J., R. Perrone, K.-H. Drüe, R. Stephan, J. Trabert, M. Hein, D. Schwanke, et al. 2007. “Comparison of High-Resolution Patterning Technologies for LTCC Microwave Circuits.” Journal of Microelectronics and Electronic Packaging 4 (3): 99–104. https://doi.org/10.4071/1551-4897-4.3.99.

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