Vol. 4, Issue 4, 2007October 01, 2007 EDT
Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (−190 and −120°C)
Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (−190 and −120°C)
Ramesham, Rajeshuni. 2007. “Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (−190 and −120°C).” Journal of Microelectronics and Electronic Packaging 4 (4): 155–66. https://doi.org/10.4071/1551-4897-4.4.155.