ISSN 1551-4897
Vol. 4, Issue 2, 2007April 01, 2007 EDT
Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit Boards
Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit Boards
Park, Jong-Won, Yun-Seok Hwang, Il-Kyoon Jeun, Da-Hee Joung, Myung-Gun Chong, and Dek-jin Yang. 2007. “Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit Boards.” Journal of Microelectronics and Electronic Packaging 4 (2): 78–85. https://doi.org/10.4071/1551-4897-4.2.78.