Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit Boards

Park, Jong-Won, Yun-Seok Hwang, Il-Kyoon Jeun, Da-Hee Joung, Myung-Gun Chong, and Dek-jin Yang. 2007. “Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit Boards.” Journal of Microelectronics and Electronic Packaging 4 (2): 78–85. https://doi.org/10.4071/1551-4897-4.2.78.