Investigation of the Lead-free Solder Joint Shear Performance

James Webster; Jianbiao Pan; Brian J. Toleno

doi:10.4071/1551-4897-4.2.72

Webster, James, Jianbiao Pan, and Brian J. Toleno. 2007. “Investigation of the Lead-Free Solder Joint Shear Performance.” Journal of Microelectronics and Electronic Packaging 4 (2): 72–77. https://doi.org/10.4071/1551-4897-4.2.72.

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