Improvement of High-Temperature Reliability of Ball Bond Using Platinum-Modified Gold Alloy Wires

Kazunari Maki; Yuji Nakata; Masayoshi Nagao; Akifumi Mishima

doi:10.4071/1551-4897-4.1.45

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Maki, Kazunari, Yuji Nakata, Masayoshi Nagao, and Akifumi Mishima. 2007. “Improvement of High-Temperature Reliability of Ball Bond Using Platinum-Modified Gold Alloy Wires.” Journal of Microelectronics and Electronic Packaging 4 (2): 45–50. https://doi.org/10.4071/1551-4897-4.1.45.

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