Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage

Wei Tan; I. Charles Ume

doi:10.4071/1551-4897-4.1.37

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Tan, Wei, and I. Charles Ume. 2007. “Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage.” Journal of Microelectronics and Electronic Packaging 4 (1): 37–44. https://doi.org/10.4071/1551-4897-4.1.37.

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