Vol. 4, Issue 1, 2007January 01, 2007 EDT
Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage
Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage
Tan, Wei, and I. Charles Ume. 2007. “Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage.” Journal of Microelectronics and Electronic Packaging 4 (1): 37–44. https://doi.org/10.4071/1551-4897-4.1.37.