Vol. 4, Issue 1, 2007January 01, 2007 EDT
Transient Thermal Characterization of a Stacked Multichip Package
Transient Thermal Characterization of a Stacked Multichip Package
Kaija, Kimmo, and Pekka Heino. 2007. “Transient Thermal Characterization of a Stacked Multichip Package.” Journal of Microelectronics and Electronic Packaging 4 (1): 23–30. https://doi.org/10.4071/1551-4897-4.1.23.