Analysis of Embedded Baluns in 3D Packages

Matti Mäntysalo; Pekka Heino

doi:10.4071/1551-4897-3.4.201

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Mäntysalo, Matti, and Pekka Heino. 2006. “Analysis of Embedded Baluns in 3D Packages.” Journal of Microelectronics and Electronic Packaging 3 (4): 201–8. https://doi.org/10.4071/1551-4897-3.4.201.

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