ISSN 1551-4897
Vol. 3, Issue 4, 2006October 01, 2006 EDT
Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications
Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications
Articles in Vol. 3, Issue 4, 2006
Vol. 3, Issue 4, 2006
- MEMS Technologies and Devices for Single-Chip RF Front-EndsClark T.-C. Nguyen
- Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array PackagesAndy PerkinsKrishna TungaSuresh Sitaraman
- LTCC Post Load CellMário R. Gongora-RubioM. RobertiZ M. da RochaL Fraigi
- Methods for Reducing Power Loss in On-Wafer InductorsPäivi H. KarjalainenPekka Heino
- Analysis of Embedded Baluns in 3D PackagesMatti MäntysaloPekka Heino
- Fabrication and Testing of a Micromirror Device Actuated by PZT Thin FilmsZ.M. XiaoB.J. ChenH. Fan
- Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC ApplicationsMing-Kun ChenCheng-Chi TaiYu-Jung Huang
Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. 2006. “Electrical Characterization of FCBGA Package Based on Measurement Approach for High-Speed SOC Applications.” Journal of Microelectronics and Electronic Packaging 3 (4): 216–25. https://doi.org/10.4071/1551-4897-3.4.216.