ISSN 1551-4897
Vol. 3, Issue 4, 2006October 01, 2006 EDT
Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications
Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications
Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. 2006. “Electrical Characterization of FCBGA Package Based on Measurement Approach for High-Speed SOC Applications.” Journal of Microelectronics and Electronic Packaging 3 (4): 216–25. https://doi.org/10.4071/1551-4897-3.4.216.