Vol. 3, Issue 2, 2006April 01, 2006 EDT
A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness Range
A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness Range
Arunasalam, Parthiban, Matthew H. Gordon, and Leonard W. Schaper. 2006. “A Systematic Approach to Thinning Silicon Wafers to the Sub-40μm Thickness Range.” Journal of Microelectronics and Electronic Packaging 3 (2): 86–94. https://doi.org/10.4071/1551-4897-3.2.86.