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Vol. 3, Issue 2, 2006April 01, 2006 EDT

Simulation of Mold Filling for Non-Newtonian Fluids - Part 2

Venkatesh M. Kulkarni, Chu Wee Liang, C.W. Tan, P.A. Aswatha Narayana, K.N. Seetharamu,
EncapsulationTransfer Molding ProcessNon-Newtonian fluidHele-Shaw modelFinite Element Method (FEM) and fluid front tracking
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-3.2.52
Journal of Microelectronics & Elect Pkg
Kulkarni, Venkatesh M., Chu Wee Liang, C.W. Tan, P.A. Aswatha Narayana, and K.N. Seetharamu. 2006. “Simulation of Mold Filling for Non-Newtonian Fluids - Part 2.” Journal of Microelectronics and Electronic Packaging 3 (2): 52–60. https:/​/​doi.org/​10.4071/​1551-4897-3.2.52.
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