Vol. 3, Issue 2, 2006April 01, 2006 EDT
Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
Kulkarni, Venkatesh M., Chu Wee Liang, C.W. Tan, P.A. Aswatha Narayana, and K.N. Seetharamu. 2006. “Simulation of Mold Filling for Non-Newtonian Fluids - Part 2.” Journal of Microelectronics and Electronic Packaging 3 (2): 52–60. https://doi.org/10.4071/1551-4897-3.2.52.