LTCC Microsystems and Microsystem Packaging and Integration Applications

K.A. Peterson; K.D. Patel; C.K. Ho; B.R. Rohrer; C.D. Nordquist; B.D. Wroblewski; K.B. Pfeifer

doi:10.4071/1551-4897-3.3.109

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Peterson, K.A., K.D. Patel, C.K. Ho, B.R. Rohrer, C.D. Nordquist, B.D. Wroblewski, and K.B. Pfeifer. 2006. “LTCC Microsystems and Microsystem Packaging and Integration Applications.” Journal of Microelectronics and Electronic Packaging 3 (3): 109–20. https://doi.org/10.4071/1551-4897-3.3.109.

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