ISSN 1551-4897
Vol. 3, Issue 1, 2006January 01, 2006 EDT
Novel Method of Separating Probe and Wire Bond Regions without Increasing Die Size and Reducing Weak Fab-Back End of Line Adhesion Interfaces
Novel Method of Separating Probe and Wire Bond Regions without Increasing Die Size and Reducing Weak Fab-Back End of Line Adhesion Interfaces
Lee, Chu-Chung (Stephen), Tu Anh Tran, Bill Williams, and Jody Ross. 2006. “Novel Method of Separating Probe and Wire Bond Regions without Increasing Die Size and Reducing Weak Fab-Back End of Line Adhesion Interfaces.” Journal of Microelectronics and Electronic Packaging 3 (1): 1–11. https://doi.org/10.4071/1551-4897-3.1.1.