Vol. 3, Issue 3, 2006July 01, 2006 EDT
Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill
Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill
Zhang, Xiaowu, D. Pinjala, E. H. Wong, Grace Chew, Zhaohui Ma, Teck Tiong Tan, and Jimmy Chew. 2006. “Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill.” Journal of Microelectronics and Electronic Packaging 3 (3): 100–108. https://doi.org/10.4071/1551-4897-3.3.100.