ISSN 1551-4897
Labie, Riet, Tomas Webers, Bart Swinnen, and Eric Beyne. 2006. “Electro-Migration Behavior of Pb-Free Flip Chip Bumps.” Journal of Microelectronics and Electronic Packaging 3 (1): 32–36. https://doi.org/10.4071/1551-4897-3.1.32.
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