Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability

Raghunandan Chaware; Leon Stiborek; Jeremias Libres; Manots Marquez; Charles Odegard; Marvin Cowens; Muthiah Venkateswaran

doi:10.4071/1551-4897-3.1.12

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Chaware, Raghunandan, Leon Stiborek, Jeremias Libres, Manots Marquez, Charles Odegard, Marvin Cowens, and Muthiah Venkateswaran. 2006. “Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability.” Journal of Microelectronics and Electronic Packaging 3 (1): 12–21. https://doi.org/10.4071/1551-4897-3.1.12.

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