Vol. 3, Issue 1, 2006January 01, 2006 EDT
Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Chaware, Raghunandan, Leon Stiborek, Jeremias Libres, Manots Marquez, Charles Odegard, Marvin Cowens, and Muthiah Venkateswaran. 2006. “Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability.” Journal of Microelectronics and Electronic Packaging 3 (1): 12–21. https://doi.org/10.4071/1551-4897-3.1.12.